A Wafer is a thin, flat slice of semiconductor material used in the fabrication of integrated circuits and other micro-devices. It is typically made from highly purified monocrystalline silicon that has been cut into circular slices (known as “dies”) and then polished to a smooth surface. The wafers are usually several millimeters thick and can range from one centimeter to over twenty centimeters in diameter. They are used as the foundation for creating the various components of an electronic device such as transistors, capacitors, resistors, and diodes. By combining multiple layers of these components on top of each other, more complex devices such as microprocessors can be fabricated.  

Wafer fabrication is the process of creating integrated circuits (ICs) on a wafer substrate. This process involves creating a patterned circuit layout on a silicon wafer, then depositing layers of material to form transistors and other electrical components. The end result is an IC that can be used in electronic devices. Wafer fabrication requires specialized equipment and techniques, as well as highly skilled personnel to complete the manufacturing process. To ensure quality and reliability, strict procedures are followed throughout each step of the wafer fabrication process, from design to testing. By combining high-tech processes with experienced technicians, companies are able to produce reliable ICs for consumer electronics or industrial applications. 

Cerebras Systems has been using the latest advancements in wafer technology to create its advanced and highly efficient Cerebras System. This system is designed for deep learning applications, and it boasts an ultra-fast interconnect speed and a massive compute capacity. Because of its wafer-based components, Cerebras System can process data faster than any other current system on the market.